REDMAGIC Tech Conference sees the debut of its most advanced cooling solution yet

REDMAGIC continues to advance its smartphone cooling technology and it showcased its latest innovations at the REDMAGIC Gaming and Liquid Cooling Technology Conference in Shenzhen. The star of the show was the industry’s first mass-produced liquid cooling system combined with advanced air-cooling innovations. You can learn more about it on the company'sofficial site.

This is liquid cooling similar to what you see in powerful gaming PCs and AI servers – a pump circulates liquid over hotspots in the machine and then towards a fan and radiator that expel the heat.

Just to be clear – we’ve seen vapor chambers sometimes be referred to as “liquid cooling”. While they do have liquid in them, they are passive cooling devices. This is an active cooling system that can handle a lot more heat.

This system needed to fit in a smartphone, so REDMAGIC went to great lengths to miniaturize the components. It built a piezoelectric ceramic micropump, which is the heart of the system. It took thousands of design iterations to reach the final design as the pump had to strike the right balance between fluid circulations and fitting inside a slim package.

The company used micron-level laser cutting to carve channels that carry the liquid between the pump and the fan. Channel membranes were designed for smooth, low-resistance flow. The liquid being pumped is an anti-freezing coolant (based on a fluorinated liquid), which remains effective between -40°C and 70°C (-40°F and 158°F). This kind of liquid is used in AI servers as it has excellent electrical insulation and heat transfer.

There were other difficulties along the way – you are pretty unlikely to drop your gaming PC, but dropping your phone isn’t all that rare. To that end, REDMAGIC used an ultra-low-temperature bonding process and new anti-puncture membranes to ensure that the phone can survive a hit – to survive tens of thousands of drop tests, actually.

Which phone is that? The upcoming REDMAGIC 11 Pro series will introduce the new liquid cooling system. It will be powered by theSnapdragon 8 Elite Gen 5with the industry-first dual-track cooling system, enabling a maximum power release for sustained high-performance gaming.

The 11 Pro phones will be able to runWuthering Wavesat 90fps for up to 120 minutes at ultra-high graphics settings, demonstrating exceptional stability and sustained performance. The device also supports more than 200 popular titles optimized for 2K resolution and 144 Hz frame rates, providing the hardware foundation for a significant leap in visual quality and gameplay smoothness.

The new models will feature the company’s Turbo Fan 4.0 system, which combines three core air-cooling approaches: independent, channel-based and composite. It includes an active cooling fan, the company’s trademark, which can spin at up to 24,000rpm. This fan is coupled with a large, continuous airflow duct and a dual-track heat dissipation system (covering the CPU and including a 4D vapor chamber heat sink).

A fan that has to draw air in and then push it out of the phone is hard to protect against water. However, REDMAGIC engineers found a way to pull it off – the Turbo Fan 4.0 system will be the first smartphone active cooling system to be rated IPX8 for resistance against submersion.

TheREDMAGIC esports phonesare the official phones for six major esports leagues in China: CrossFire Mobile Pro League, Arena Breakout Pioneer Cup, QQ Speed Mobile S League, Call of Duty Mobile Masters, League of Legends Mobile Super League and Dawn Heroes Team Tournament.

The REDMAGIC devices are trusted for their reliability. Chen Jin, head of Tencent’s K1 CrossFire product operations, says that “the devices reduce abnormal exits, mid-match disconnects, and spare device usage, meeting the stringent demands of professional tournaments.”

The upcoming REDMAGIC 11 Pro series will push smartphone gaming performance even further and set new standards for speed and stability.

For more, head over toredmagic.gg.